In millimeter wave designs, compression mount connectors can be used to avoid problems commonly associated with solder variations. However, when using compression mount connectors, the potential impact of pin compression and/or misalignment on electrical performance at high frequencies should be considered. Using modeled and measured data, this white paper investigates how misalignment and pin compression could impact a real-world design. It also explains how to detect and avoid issues in order to optimize performance and complete a successful design.
What happens when you combine a high bandwidth RF connector with an optimized PCB launch and solder them together? Unfortunately, the result can be unpredictable. This white paper will identify the root causes of variations often associated with solder joints, and explore ways to better predict solder reflow.